IPP’s Cool Chip is designed to draw heat from one location that is too hot to a different location that can absorb the heat. These devices are manufactured on a highly thermally conductive ceramic substrate (Aluminum Nitride) that is electrically isolated and safe to use. The terminals are gold-plated over nickel, making them easy to solder with many different alloy types. These devices are ideal for small, compact areas with high heat concentrations, intended for both military and commercial applications. The Cool Chips come with or without an edge wrap, in three sizes: 0805, 1010, and 1206. Cool Chips are made in the USA with the same high quality that IPP is known for.
Aluminum nitride is renowned for its superior thermal conductivity, which far exceeds that of traditional materials. This makes it an ideal choice for high-performance cooling solutions. The New Cool Chip utilizes AlN’s exceptional thermal properties to effectively transfer heat away from sensitive electronic components, thus preventing overheating and maintaining system stability.
APPLICATIONS: PIN and Laser Diodes, RF Amplifiers, Capacitors, Transistors, Power Supplies, Filters, Resistors
View Technical Data Sheet with test results.
| Part Numbers | Length: inches (mm) | Width: inches (mm) | Depth: inches (mm) | Thermal Resistance (W/°C) | Capacitance Series (pF) | Capacitance Shunt (pF) |
| IPP-CCN0805-40 | 0.080 (2.032) | 0.050 (1.270) | 0.020 (0.508) | 9.26 | < 0.10 | < 0.10 |
| IPP-CCN0805-40N | 0.080 (2.032) | 0.050 (1.270) | 0.020 (0.508) | 13.9 | < 0.10 | < 0.10 |
| IPP-CCN1206-40 | 0.120 (3.048) | 0.060 (1.524) | 0.025 (0.635) | 11.58 | < 0.10 | < 0.10 |
| IPP-CCN1206-40N | 0.120 (3.048) | 0.060 (1.524) | 0.025 (0.635) | 14.67 | < 0.10 | < 0.10 |
| IPP-CCN1010-40 | 0.100 (2.540) | 0.100 (2.540) | 0.020 (0.508) | 5.8 | < 0.10 | < 0.15 |
| IPP-CCN1010-40N | 0.100 (2.540) | 0.100 (2.540) | 0.020 (0.508) | 9.26 | < 0.10 | < 0.15 |
